Backside deposition prevention on substrates
AssigneeLam Research Corporation
InventorsChristopher GAGE, Ramesh CHANDRASEKHARAN, Eric H. LENZ, Karl Frederick LEESER
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AssigneeLam Research Corporation
InventorsChristopher GAGE, Ramesh CHANDRASEKHARAN, Eric H. LENZ, Karl Frederick LEESER
Estimating the term…
Various systems and methods are provided to prevent backside deposition on a substrate by using a combination of approaches. The approaches include clamping the substrate to a pedestal and/or supplying purge gases to an area where deposition is not desired. The clamping methods include electrostatic or vacuum clamping. In addition, various pedestal and edge ring designs are provided for supplying purge gases to the area where deposition is not desired. The use of clamping in conjunction with purging can further enhance the performance without affecting deposition of materials on front side of the substrate. The clamping along the edge of the substrate can be made more effective by machining an upper surface of the pedestal to have a slight dish or dome like shape (i.e., concave or convex, respectively).
A pedestal comprising:
A pedestal to support a substrate, the pedestal comprising:
A pedestal assembly comprising:
A pedestal assembly comprising:
A pedestal assembly comprising:
A pedestal assembly comprising:
Dependencies are inferred from the claim text.