Curable composition and cured product thereof

2:

• The curable composition according to claim 1, wherein the wetting and dispersing additive is a phosphorus-based wetting and dispersing additive.

3:

• The curable composition according to claim 1, wherein the crystalline flame retardant includes a phosphorus-based crystalline flame retardant, and a content proportion of phosphorus derived from the phosphorus-based crystalline flame retardant in the curable composition is in a range of 1% by weight to 10% by weight.

4:

• The curable composition according to claim 1, wherein the curable composition has a viscosity of 50 mPa·s or lower at 50° C.

5:

• A cured product obtained by a process comprising curing the curable composition of claim 1.

6:

• An electronic component, comprising:
• the cured product of claim 5.

7:

• The curable composition according to claim 2, wherein the crystalline flame retardant includes a phosphorus-based crystalline flame retardant, and a content proportion of phosphorus derived from the phosphorus-based crystalline flame retardant in the curable composition is in a range of 1% by weight to 10% by weight.

8:

• The curable composition according to claim 2, wherein the curable composition has a viscosity of 50 mPa·s or lower at 50° C.

9:

• A cured product obtained by a process comprising curing the curable composition of claim 2.

10:

• An electronic component, comprising:
• the cured product of claim 9.

11:

• The curable composition according to claim 3, wherein the curable composition has a viscosity of 50 mPa·s or lower at 50° C.

12:

• A cured product obtained by a process comprising curing the curable composition of claim 3.

13:

• An electronic component, comprising:
• the cured product of claim 12.

14:

• A cured product obtained by a process comprising curing the curable composition of claim 4.

15:

• An electronic component, comprising:
• the cured product of claim 14.

16:

• The curable composition according to claim 7, wherein the curable composition has a viscosity of 50 mPa·s or lower at 50° C.

17:

• A cured product obtained by a process comprising curing the curable composition of claim 7.

18:

• An electronic component, comprising:
• the cured product of claim 17.

19:

• A cured product obtained by a process comprising curing the curable composition of claim 16.

20:

• An electronic component, comprising:
• the cured product of claim 19.