Resin composition and electronic device

An electronic device comprising a resin layer, a compound layer, and a metallic conductive layer, wherein the compound layer comprises a compound having a structure represented by the following general formula (7):

• in the general formula (7), X7 to X9 each represent —N═, —NH—, or —CR1—;
• X10 to X13 each represent —N═ or —CR1—;
• R1 represents a hydrogen atom, an aryl group, a heteroaryl group, an alkyl group, an alkenyl group, an alkynyl group, an alkoxy group, an amino group, a cyano group, a silyl group, a thiol group, a carbonyl group, a halogen atom, a trifluoromethyl group, or a hydroxy group, and optionally further has a substituent, and at least one of X10 to X13 represents —N═;
• and A3 and A4 form a heteroaryl ring,
• the metallic conductive layer, the compound layer, and the resin layer are laminated in this order, and
• the compound layer is formed only between the metallic conductive layer and the resin layer.