Alumina particles and resin composition using same

Abstract

Provided is an alumina particle for use as a filler for resin compositions, which can improve the thermal conductivity of the resin composition over conventional resin compositions. It is an alumina particle having a particle diameter D50 of more than 100 μm at a cumulative value of 50% from the fine particle side in the cumulative particle size distribution, and having an α-alumina rate of 90% or more; wherein the α-alumina is a monocrystalline alumina. The alumina particle preferably has a Na content of 800 ppm or less. In addition, the alumina particle preferably has a particle diameter D10 of 70 to 135 μm at a cumulative value of 10% from the fine particle side in the cumulative particle size distribution.

Dependencies are inferred from the claim text.