Adhesive-free packaging structure
AssigneeWistron Neweb Corp.
InventorYa-Wen CHENG
Life of this patent
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AssigneeWistron Neweb Corp.
InventorYa-Wen CHENG
Estimating the term…
An adhesive-free packaging structure includes a substrate, at least one foldable area, and at least one first connecting structure. The substrate includes a first end portion and a second end portion, and a material of the substrate includes a natural fiber. The foldable area is disposed on the substrate and includes at least one folding line. The first connecting structure is disposed on the substrate and includes a first connecting element and a second connecting element respectively disposed on the first end portion and the second end portion. When the substrate is bent along the foldable area, the first end portion and the second end portion approach each other and the first connecting element and the second connecting element are correspondingly assembled.
An adhesive-free packaging structure, comprising:
An adhesive-free packaging structure comprising:
Dependencies are inferred from the claim text.