Pi-shaped preform and bonded joints thereof
AssigneeLockheed Martin Corporation
InventorsRobert Warner Koon, Felix Nhanchau Nguyen, Daniel H. Hecht, Carl Q. Rousseau
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AssigneeLockheed Martin Corporation
InventorsRobert Warner Koon, Felix Nhanchau Nguyen, Daniel H. Hecht, Carl Q. Rousseau
Estimating the term…
According to some embodiments, an interface assembly for coupling an orthogonal circuit board to a main circuit board includes a frame, signal pins, and dielectric retainers. The frame is electrically coupled to a ground signal of the orthogonal circuit board. The dielectric retainers electrically isolate the plurality of signal pins from the frame. The frame includes an interface surface configured to electrically couple the frame to a plurality of ground spring pins of a spring interposer of the main circuit board. Each particular signal pin of the interface assembly includes a pin head configured to electrically couple the particular signal pin to a particular one of a plurality of signal spring pins of the spring interposer. The interface surface of the frame and the pin heads of the plurality of signal pins form a coplanar surface.
A pi-shaped preform comprising:
(canceled)
A pi-joint assembly comprising:
(canceled)
A method of manufacturing a pi-shaped preform comprising:
Dependencies are inferred from the claim text.