Back to results
US 2024/0198558 A1Published application
Cutting method and method for manufacturing multilayer ceramic component
AssigneeKYOCERA Corporation
InventorHisashi SATO
Life of this patent
Estimating the term…
Abstract
A multilayer base is placed on a support. The multilayer base is cut by moving a cutting blade including an edge being linear through the multilayer base in a direction parallel to a surface of the support on which the multilayer base is placed. The cutting blade is moved with the edge inclined with respect to a moving direction of the cutting blade.
Claims10
A method for cutting a multilayer base, the method comprising:
- placing the multilayer base on a support, the multilayer base including ceramic green sheets and electrode layers stacked alternately;
- and
- cutting the multilayer base by moving a cutting blade including an edge being linear through the multilayer base in a direction parallel to a surface of the support on which the multilayer base is placed, the cutting blade being moved with the edge inclined with respect to a moving direction of the cutting blade.
Dependencies are inferred from the claim text.