Damage prevention during wafer edge trimming

A method comprising:

• positioning a wafer over a wafer chuck;
• using a rotating blade to remove an annular portion of an upper surface of the wafer, wherein the wafer is being rotated at a first rotation speed;
• as the rotating blade is removing the annular portion of the upper surface of the wafer, measuring a parameter of the wafer;
• and
• changing the first rotational speed of the wafer to a second rotational speed based on a comparison involving the parameter and a predetermined threshold.

A method of processing a wafer comprising:

• using a rotating blade to remove an annular portion of the wafer;
• as the rotating blade is removing the annular portion of the wafer, measuring a parameter of the wafer;
• and
• changing a process variable based on a comparison involving the parameter and a predetermined threshold.