Plated metal bonding method and plated metal bonding apparatus
AssigneeUltex Corporation
InventorShigeru SATO
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Abstract
A stable bonding processing for metal, of which at least a part is plated, is provided. A plated metal bonding apparatus performs bonding of a first metal and a second metal. At least one from among the first metal and the second metal has a plated bonding portion where the bonding processing is to be performed. A bonding processing unit performs bonding of the first metal and the second metal using sound vibration and/or ultrasound vibration. The bonding processing unit performs the bonding processing using a plated material or otherwise using a metal portion in a state in which a plating material has been removed.
Claims4
A plated metal bonding method for bonding a plurality of metals, comprising bonding in which a bonding processing unit bonds a plurality of metals using sound vibration and/or ultrasound vibration,
- wherein the plurality of metals comprises a first metal and a second metal,
- wherein the first metal has a first plated bonding portion where the bonding is to be performed, and
- wherein the second metal is not plated at a bonding portion, and
- wherein the bonding processing unit discharges a plating material from the first plated bonding portion by the sound vibration and/or the ultrasound vibration and bonds the first metal and the second metal.
Dependencies are inferred from the claim text.