Copper paste for printing capillary structure and preparation method thereof

Abstract

The present invention discloses a copper paste for printing a capillary structure and a preparation method thereof. The copper paste consists of copper powder, a high molecular polymer, a solvent, a binder, a dispersant, a leveling agent, a tackifier and an antioxidant. Through the limitation on the copper powder and the high molecular polymer in the copper paste of the present invention, the prepared copper paste can be applied to a carrier of a vapor chamber by blade coating or screen printing, and then used as a wick after binder removal and sintering in hydrogen or hydrogen-nitrogen mixed gas, so as to reduce device investment and cost; and the thickness of the wick can be accurately controlled to be 10-100 μm, the structural strength is higher, the water absorption performance and the heat transfer performance are better, and the demand for miniaturization of electronic products is met.

Dependencies are inferred from the claim text.