Organic light-emitting diode display panel and manufacturing method thereof

An organic light-emitting diode (OLED) display panel, comprising a display area and a bonding area, and further comprising:

• a substrate;
• an array structure layer, disposed on the substrate;
• a pad, disposed on a side of the array structure layer away from the substrate and located in the bonding area, wherein the pad comprises a first metal layer and a second metal layer stacked, the second metal layer is disposed on a side of the first metal layer away from the array structure layer, and an edge of the second metal layer protrudes from an edge of the first metal layer;
• an anode, disposed on the side of the array structure layer away from the substrate and located in the display area;
• a pixel defining layer, disposed on a side of the anode away from the substrate, extending to cover the array structure layer, and located in the display area, wherein the pixel defining layer is provided with a pixel hole at a position corresponding to the anode;
• a light-emitting material layer, disposed in the pixel hole of the pixel definition layer;
• an electronic functional layer, disposed on the light-emitting material layer, and extending to cover the pixel definition layer, the array structure layer, and the pad;
• wherein the electronic functional layer covered on the second metal layer is disconnected from the electronic functional layer covered on the array structure layer;
• and
• a cathode, disposed on a side of the electronic functional layer away from the array structure layer and covering a side of the second metal layer adjacent to the array structure layer.

A method of manufacturing an OLED display panel, comprising:

• providing a substrate and defining a display area and a bonding area on the substrate;
• forming an array structure layer on the substrate;
• forming an anode and a pad on a side of the array structure layer away from the substrate, wherein the pad is located on the bonding area, and the anode is located in the display area;
• the pad comprises a first metal layer and a second metal layer on a side of the first metal layer away from the array structure layer, and an etching amount of the first metal layer is greater than an etching amount of the second metal layer to make that an edge of the second metal layer protrudes from an edge of the first metal layer;
• forming a pixel defining layer on a side of the anode away from the substrate, wherein the pixel defining layer extends to cover the array structure layer and is located in the display area, and the pixel defining layer is provided with a pixel hole at a position corresponding to the anode;
• forming a light-emitting material layer in the pixel hole of the pixel definition layer;
• forming an electronic functional layer on the light-emitting material layer, wherein the electronic functional layer extends to cover the pixel definition layer, the array structure layer, and the pad;
• the electronic functional layer covered the second metal layer is disconnected from the electronic functional layer covered the array structure layer;
• and
• forming a cathode on a side of the electronic functional layer away from the array structure layer, wherein the cathode covers a side of the second metal layer adjacent to the array structure layer.