Memory device and manufacturing method thereof
AssigneeYangtze Memory Technologies Co., Ltd.
InventorsHe CHEN, Ziqun HUA, Hongbin ZHU
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AssigneeYangtze Memory Technologies Co., Ltd.
InventorsHe CHEN, Ziqun HUA, Hongbin ZHU
Estimating the term…
A method of forming a memory device including providing a base wafer that includes a substrate, an insulation layer over the substrate, a sacrificial layer over the insulation layer, and a plurality of channel layers embedded in the sacrificial layer and the insulation layer, forming a plurality of grooves in the sacrificial layer each exposing a portion of the insulation layer and separating two adjacent rows of the channel layers, filling the plurality of grooves with an insulation material to form a plurality of spacers, removing the sacrificial layer to form a plurality of trenches that expose portions of the insulation layer and a portion of a sidewall of each of the channel layers, and forming a plurality of gate layers in the trenches.
A method of forming a memory device comprising:
A memory device comprising:
A memory system comprising:
Dependencies are inferred from the claim text.