Thermal isolation for memory systems

An apparatus, comprising:

• a printed circuit board;
• a memory device mounted to the printed circuit board;
• a controller mounted to the printed circuit board and electrically coupled with the memory device;
• and
• a heat transfer assembly comprising:
• a first heatsink comprising a thermally conductive component extending over a first area of the printed circuit board and a first thermal transfer component extending over a second area of the printed circuit board;
• a second heatsink comprising a second thermal transfer component extending over a third area of the printed circuit board, wherein the third area at least partially overlaps along a plane of the printed circuit board with the first area;
• and
• a partition between the first heatsink and the second heatsink configured to provide thermal isolation between the first heatsink and the second heatsink, the partition extending in a direction orthogonal to the plane.

An apparatus, comprising:

• a printed circuit board comprising a circuit region and a connector region;
• a controller mounted to the printed circuit board within the circuit region;
• a set of memory devices mounted to the printed circuit board within the circuit region and electrically coupled with the controller;
• and
• an upper heat transfer assembly comprising:
• a first heatsink thermally coupled with the controller;
• a second heatsink thermally coupled with the set of memory devices;
• a partition between the first heatsink and the second heatsink configured to provide thermal isolation between the first heatsink and the second heatsink;
• and
• a lower heat transfer assembly coupled with the upper heat transfer assembly,
• wherein the circuit region of the printed circuit board is enclosed between the upper heat transfer assembly and the lower heat transfer assembly.