System And Method For Cooling Electronic Computing Device With Multiple-Function Pump

A method for cooling an electronic computing device with a cooling distribution system, the method comprising:

• providing a main cooling path along a plurality of hot-swappable pump modules mounted within a distribution unit chassis, the main cooling path being configured to cool an electronic computing device external to the distribution unit chassis;
• introducing a coolant in the main cooling path via a coolant inlet manifold that is mounted within the distribution unit chassis;
• collecting in a coolant collection pan leaked coolant from the main cooling path;
• sensing presence of the leaked coolant in the coolant collection pan;
• and
• triggering pumping, via a recycle cooling path, of the leaked coolant from the coolant collection pan back to the coolant inlet manifold, the recycle cooling path including a recycle pump fluidly coupled between the coolant collection pan and the coolant inlet manifold.

A cooling distribution system for a computing device, the cooling distribution system comprising:

• a distribution unit chassis;
• one or more hot-swappable pump modules mounted at least in part within the distribution unit chassis for cooling electronic components, the one or more hot-swappable pump modules being configured to circulate a coolant along a main cooling path;
• one or more hot-swappable filter modules mounted at least in part within the distribution unit chassis and fluidly coupled along the main cooling path;
• a system coolant inlet mounted at least in part within the distribution unit chassis, the system coolant inlet being fluidly coupled with the main cooling path to supply a new coolant along an inlet cooling path, the system coolant inlet being configured to receive the new coolant from an external coolant supply source;
• a system coolant outlet mounted at least in part within the distribution unit chassis, the system coolant outlet being fluidly coupled with the main cooling path to remove coolant;
• a coolant inlet manifold mounted within the distribution unit chassis and fluidly coupled to the main cooling path;
• a coolant collection pan for collecting leaked coolant from the coolant circulating along the main cooling path;
• and
• a recycle pump configured to change between
• a recycle mode in which the recycle pump is fluidly coupled to form a recycle cooling path between the coolant collection pan and the coolant inlet manifold, the recycle pump pumping the leaked coolant from the coolant collection pan back to the coolant inlet manifold, and
• a supply mode in which the recycle pump is fluidly coupled to form a supply cooling path between the recycle pump and the coolant inlet manifold, the recycle pump pumping the new coolant from the external coolant supply source, the supply cooling path being additional to the inlet cooling path.