Process method for laser removal of substrate solder mask

A process method for laser removal of substrate solder mask, which is to process a substrate through a laser with controllable energy, the process method for laser removal of substrate solder mask comprising the steps of:

• S101:
• providing a substrate where the surface of said substrate is provided with solder pads;
• S102:
• covering the surface of said substrate and said solder pads with a solder mask, where the part of said solder mask facing the surface of said substrate is defined as a shielding part and the part of said solder mask facing said solder pads is defined as a clearing part;
• S103:
• reading the QR-Code of a plate production part number on said substrate through at least one camera module;
• S104:
• automatically importing data of a CAD/CAM data to a laser device, where said CAD/CAM data corresponds to said plate production part number;
• S105:
• performing stripping operation on said clearing part sequentially according to said CAD/CAM data through a laser beam;
• S106:
• making said solder mask form at least one hollow portion;
• S107:
• taking pictures of said substrate through said at least one camera module and taking out a processed substrate picture;
• S108:
• comparing and judging whether said processed substrate picture is the same as said CAD/CAM data;
• and
• S109:
• completing the substrate processing operation if said processed substrate picture is the same as said CAD/CAM data.