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US 2024/0196514 A1Published application
Cooling of ultrasound energizers mounted on printed circuit boards
AssigneeSofwave Medical Ltd.
InventorsAriel SVERDLIK, Erez PANIR
Life of this patent
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Abstract
An assembly including: a printed circuit board (PCB) having a first surface and a second surface; at least one energy transmitter mounted on the first surface; at least one cooling element associated with the PCB second surface, wherein the cooling element is configured to cool the at least one energy transmitter via the PCB.
Claims25
An energy transmitting assembly unit, comprising:
- a plurality of ultrasound transducers;
- a thin circuit board having a first surface and a second surface and a thickness up to 3 mm, wherein said plurality of ultrasound transducers are mounted on said first surface;
- wherein said thin circuit board comprises:
- electrical wiring in or on said thin circuit board coupled to each of said plurality of ultrasound transducers;
- a plurality of heat conducting regions in said thin circuit board positioned between said first surface and said second surface to selectively increase heat conductivity through the thin circuit board, wherein at least some of said heat conducting regions are filled at least partly with a heat conducting material.
2 more elements
Dependencies are inferred from the claim text.