Heat management device for an electrical and/or electronic component
AssigneeValeo Systemes Thermiques
InventorsCedric DE VAULX, Kamel AZZOUZ, Jeremy BLANDIN, Yolanda BRAVO
Life of this patent
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Abstract
The invention relates to a heat management device (2) for at least one electrical and/or electronic component (4) for an electrical storage device (1), comprising at least one thermal regulation means (8), the heat management device (2) being characterized in that it further comprises a rigid supporting part (6) comprising at least one cavity (10) for receiving the at least one electrical and/or electronic component (4), the rigid supporting part (6) being made of a material with high thermal conductivity.
Claims10
A heat management device for at least one electrical and/or electronic component, comprising at least one thermal regulation component, a rigid supporting part with at least one receiving cavity for receiving the at least one electrical and/or electronic component, with the rigid supporting part being made of a material with high thermal conductivity.
An electronic system comprising at least one electrical and/or electronic component and at least one heat management device including at least one thermal regulation component, a rigid supporting part with at least one receiving cavity for receiving the at least one electrical and/or electronic component, with the rigid supporting part being made of a material with high thermal conductivity.
A method for assembling an electronic system, including at least one electrical and/or electronic component and at least one heat management device including at least one thermal regulation component, a rigid supporting part with at least one receiving cavity for receiving the at least one electrical and/or electronic component, with the rigid supporting part being made of a material with high thermal conductivity, wherein at least one heat-conducting interface is arranged in the at least one receiving cavity, the at least one heat-conducting interface being configured to be arranged between the rigid supporting part and the at least one electrical and/or electronic component, wherein the at least one electrical and/or electronic component and the at least one heat-conducting interface are arranged in the at least one receiving cavity of the rigid supporting part, comprising inserting the at least one electrical and/or electronic components into the receiving cavities, wherein the at least one electrical and/or electronic component is previously surrounded by the at least one heat-conducting interface and the assembly formed by the at least one electrical and/or electronic component and the at least one heat-conducting interface is inserted into the receiving cavity of the rigid supporting part.
Dependencies are inferred from the claim text.