Enhanced area getter architecture for wafer-level vacuum packaged uncooled focal plane array

A method of fabricating a focal plane array (FPA) assembly, the method comprising:

• providing a handle wafer having a bonding side and a planar side opposing the bonding side;
• providing a silicon on insulator wafer having a first side and a second side opposite the first side;
• providing a device wafer having a plurality of solder joints;
• bonding the first side of the silicon on insulator wafer to the bonding side of the handle wafer;
• forming a plurality of seal ring metallizations on the second side of the silicon on insulator wafer;
• etching a recess into the second side of the silicon on insulator wafer to expose a portion of the bonding side of the handle wafer and forming a plurality of recess walls;
• forming a first anti-reflection coating on a first portion of the planar side of the handle wafer;
• forming a second anti-reflection coating on a second portion of the bonding side of the handle wafer;
• depositing getter material on a third portion of the bonding side of the handle wafer, on the plurality of recess walls and on a fourth portion of the second side of the silicon on insulator wafer;
• and
• bonding the device wafer to the second side of the silicon on insulator wafer.