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US 2024/0194649 A1Published application
Semiconductor device and method of manufacturing thereof
AssigneeAmkor Technology Singapore Holding Pte. Ltd.
InventorsWon Geol Lee, Won Chul Do, Ji Hun Yi
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Abstract
Various aspects of this disclosure provide a semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device comprising a stacked die structure and a method of manufacturing thereof.
Claims20
A semiconductor device comprising:
- a first substrate;
- a first metal pillar on a first side of the first substrate;
- a first semiconductor die coupled to the first side of the first substrate;
- a second metal pillar on the first metal pillar;
- a second semiconductor die coupled to the first semiconductor die;
- a second substrate on the second metal pillar and on the second semiconductor die;
- and
- encapsulating material between the first substrate and the second substrate and encapsulating at least a side of each of the first metal pillar, the first semiconductor die, the second metal pillar and the second semiconductor die.
5 more elements
A semiconductor device comprising:
- a first substrate;
- a first metal pillar plated on a first side of the first substrate;
- a first semiconductor die comprising:
- a first side facing away from the substrate;
- and
- a second side facing the substrate, and comprising pads that are connected to the first side of the substrate with conductive bumps;
- a second metal pillar plated on the first metal pillar;
- a second semiconductor die comprising:
- a first side facing away from the first semiconductor die and comprising pads;
- and
- a second side coupled to the first side of the first semiconductor die;
- a second substrate comprising:
- a first side facing away from the second semiconductor die;
- and
- a second side facing the first semiconductor die and comprising a conductive layer connected to the pads of the second semiconductor die;
- and
- encapsulating material between the first substrate and the second substrate and encapsulating at least lateral sides of the first metal pillar, the first semiconductor die, the second metal pillar and the second semiconductor die.
14 more elements
A method of manufacturing a semiconductor device, the fabricating method comprising:
- providing a first substrate;
- forming a first metal pillar on a first side of the first substrate;
- coupling a first semiconductor die to the first side of the first substrate;
- forming a second metal pillar on the first metal pillar;
- coupling a second semiconductor die to the first semiconductor die;
- forming a second substrate on the second metal pillar and on the second semiconductor die;
- and
- forming an encapsulating material between the first substrate and the second substrate that encapsulates at least a side of each of the first metal pillar, the first semiconductor die, the second metal pillar and the second semiconductor die.
5 more elements
Dependencies are inferred from the claim text.