Power semiconductor device
AssigneeMitsubishi Electric Corporation
InventorsHirotaku ISHIKAWA, Koki KISHIMOTO, Kazutake KADOWAKI, Kunihiko TAJIRI, Yoshitaka MIYAJI, Hiroki SHIOTA, Yasutomo OTAKE
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AssigneeMitsubishi Electric Corporation
InventorsHirotaku ISHIKAWA, Koki KISHIMOTO, Kazutake KADOWAKI, Kunihiko TAJIRI, Yoshitaka MIYAJI, Hiroki SHIOTA, Yasutomo OTAKE
Estimating the term…
A power semiconductor according to the present disclosed technology is a case-type power semiconductor device, in which a case is formed by mixing a heavy element material and a conductive material with a material having high processability, the conductive material is not a light metal, and the electric resistance of the case is 1.0 E5 to 1.0 E11 [Ω]. In addition, the power semiconductor according to the present disclosed technology is a transfer mold-type power semiconductor device, and includes a transfer mold-type sealing resin including a sealing resin containing a heavy element material and a sealing resin containing a conductive material, in which the conductive material of the sealing resin containing a conductive material is not a light metal.
A case-type power semiconductor device, wherein
A transfer mold-type power semiconductor device, comprising
Dependencies are inferred from the claim text.