US 2024/0194564 A1 · FLUIDIC-CHANNEL COOLED SUBSTRATES

Abstract

In a general aspect, a semiconductor device module includes a ceramic substrate having a first surface and a second surface opposite the first surface, a patterned metal layer disposed on the first surface of the ceramic substrate, a semiconductor die disposed on the patterned metal layer, and a cooling structure disposed on the second surface of the ceramic substrate. The cooling structure includes a plurality of copper sheets defining a plurality of fluidic-cooling channels. At least one copper sheet of the plurality of copper sheets is at least one of coated or plated with a corrosion-resistant material. The module also includes a molding compound that encapsulates the ceramic substrate, the patterned metal layer and the semiconductor die. The molding compound also partially encapsulates the cooling structure, such that a fluidic interface surface of the cooling structure is exposed through the molding compound.

Claims20

Dependent claims

A semiconductor device module comprising:

a ceramic substrate having a first surface and a second surface opposite the first surface;
a patterned metal layer disposed on the first surface of the ceramic substrate;
a semiconductor die disposed on the patterned metal layer;
a cooling structure disposed on the second surface of the ceramic substrate, the cooling structure including a plurality of copper sheets defining a plurality of fluidic-cooling channels, at least one copper sheet of the plurality of copper sheets being at least one of coated or plated with a corrosion-resistant material;
and
a molding compound that:
encapsulates the ceramic substrate, the patterned metal layer and the semiconductor die;
and
partially encapsulates the cooling structure, such that a fluidic interface surface of the cooling structure is exposed through the molding compound.

6 more elements

An electronic device assembly comprising:

a molded semiconductor device module including:
a ceramic substrate having a first surface and a second surface opposite the first surface;
a patterned metal layer disposed on the first surface of the ceramic substrate;
a semiconductor die disposed on the patterned metal layer;
a cooling structure disposed on the second surface of the ceramic substrate, the cooling structure including a plurality of fluidic-cooling channels;
and
a molding compound that:
encapsulates the ceramic substrate, the patterned metal layer and the semiconductor die;
and
partially encapsulates the cooling structure, such that a fluidic interface surface of the cooling structure is exposed through the molding compound;
a coolant distributor coupled with the fluidic interface surface of the cooling structure;
and
a fluidic-cooling jacket having:
a coolant inlet;
a first fluidic circuit configured to provide a first portion of a coolant flow received at the coolant inlet to the coolant distributor;
a second fluidic circuit configured such that a second portion of the coolant flow bypasses the coolant distributor;
and
a coolant outlet configured to receive the first portion of the coolant flow and the second portion of the coolant flow for egress from the fluidic-cooling jacket.

15 more elements

Dependencies are inferred from the claim text.

Fluidic-channel cooled substrates

Life of this patent

Fluidic-channel cooled substrates

Life of this patent

Abstract

Claims20