Semiconductor device assemblies with an encapsulant material having enhanced thermal conductivity, and methods for making the same
AssigneeMicron Technology, Inc.
InventorsMin Hua Chung, Chong Leong Gan
Life of this patent
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Abstract
A semiconductor device assembly is provided. The assembly includes a support layer with an inside surface, a semiconductor device, and an encapsulant material. The encapsulant material includes a bulk material and thermally conductive nanoparticles, each nanoparticle having an electrically insulative shell and an electrically conductive core. The semiconductor device is disposed on the inside surface of the support layer, the thermally conductive nanoparticles are evenly distributed throughout the bulk material, and the encapsulant material at least partially encapsulates the semiconductor device.
Claims20
A semiconductor device assembly, comprising:
- a support layer with an inside surface;
- a semiconductor device disposed on the inside surface;
- and
- an encapsulant material at least partially encapsulating the semiconductor device, including:
- a bulk material, and
- thermally conductive nanoparticles distributed through the bulk material, each nanoparticle having an electrically insulative shell and an electrically conductive core.
An encapsulant material, comprising:
- a bulk material;
- and
- thermally conductive nanoparticles distributed throughout the bulk material, each nanoparticle having an electrically insulative shell and an electrically conductive core.
A method of making an encapsulant material, the method comprising:
- providing a bulk material;
- providing thermally conductive nanoparticles, each nanoparticle having an electrically insulative shell and an electrically conductive core;
- mixing the thermally conductive nanoparticles into the bulk material so that the nanoparticles are distributed throughout the bulk material.
Dependencies are inferred from the claim text.