Processing method and plasma processing apparatus

A plasma processing apparatus, comprising:

• a processing chamber being decompressible;
• a substrate support located in the processing chamber and including a support surface on which a substrate is placeable;
• a heat transfer layer formation unit configured to form a heat transfer layer for the temperature adjustment target on the support surface of the substrate support, the heat transfer layer being deformable and including at least one of a liquid layer or a deformable solid layer;
• and
• a controller configured to perform control to cause operations including
• placing the temperature adjustment target onto the support surface, and
• performing plasma processing on the substrate on the support surface on which the heat transfer layer is formed.