Dies, semiconductor package structures, enable pin configuration methods and memories

A semiconductor package structure, wherein the semiconductor package structure comprises N dies configured to at least receive control commands, and generate indication information according to the control commands, the control commands for indicating the die to determine an address of the die, the indication information being used for indicating M dies to share a same enable pin, M being a positive integer greater than or equal to 1;

• and
• determine the address of the die according to the indication information, and send the address of the die, which is used for addressing an enable signal provided by the enable pin;
• M dies among the N dies are used for receiving control commands, the control commands are used for indicating the M dies to determine respective addresses, which are used for addressing the enable signals provided by the enable pins, M is a positive integer greater than or equal to 1, N is a positive integer greater than or equal to 2, and M is less than or equal to N;
• and
• the M dies are further used for sending the respective addresses.