Semiconductor structure and method for forming the same

A method for forming a semiconductor structure, comprising:

• receiving a die;
• forming a dielectric layer to surround the die;
• disposing a photoelectric device surrounded by the dielectric layer;
• forming a redistribution layer over the die, the dielectric layer and the photoelectric device;
• removing a portion of the redistribution layer to form a first opening over the photoelectric device;
• disposing a light-conducting member in the first opening and optically coupled to the photoelectric device;
• and
• forming a metallic shield extending at least partially through the redistribution layer and surrounding the light-conducting member during the formation of the redistribution layer.

A method for forming a semiconductor structure, comprising:

• receiving a die;
• forming a dielectric layer to surround the die;
• disposing a photoelectric device surrounded by the dielectric layer;
• forming a redistribution layer over the die, the dielectric layer and the photoelectric device;
• disposing a light-conducting member extending through the redistribution layer and optically coupled to the photoelectric device;
• and
• forming a metallic shield extending at least partially through the redistribution layer and surrounding the light-conducting member during the formation of the redistribution layer,
• wherein at least a portion of the redistribution layer is disposed between the light-conducting member and the metallic shield.