Heterogeneous package structures with photonic devices

A package structure, comprising:

• at least one application specific integrated circuit device;
• at least one photonic device comprising an optical transceiver system;
• at least one bridge interconnect device configured to electrically connect the at least one application specific integrated circuit device to the at least one photonic device;
• at least one optical waveguide device which is optically coupled to the at least one photonic device to implement an optical bus for routing optical signals in the package structure;
• and
• an optical connection device which is optically coupled to the at least one optical waveguide device, wherein the optical connection device is configured for connection to external optical fibers which transmit and receive optical signals to and from the optical transceiver system over the optical bus.

A package structure, comprising:

• a plurality of package levels disposed in a vertically stacked configuration, wherein at least one package level comprises:
• at least one electronic device;
• at least one photonic device;
• at least one bridge interconnect device configured to electrically connect the at least one electronic device to the at least one photonic device;
• and
• at least one optical waveguide device that is optically coupled to the at least one photonic device to implement an optical bus for routing optical signals in the package structure;
• wherein the at least one photonic device is configured to implement an electro-optical interface between the at least one electronic device and the optical bus.