Apparatus for measuring wafer bonding strength and method of operating the apparatus and method of measuring wafer bonding strength
AssigneeSK hynix Inc.
InventorsJung Hwan PARK, Ji Hye LEE
Life of this patent
Estimating the term…
Abstract
An apparatus for measuring wafer bonding strength may include a wafer fixer and measuring unit. The wafer fixer may be configured to fix bonded wafers. The measuring unit may be configured to measure bonding strength of the bonded wafers. The measuring unit may include a blade, a driver and a sensor. The blade may apply a force to an interface between the bonded wafers to separate the bonded wafers from each other. The driver may provide the blade with a driving force. The sensor may measure the force applied to the blade.
Claims19
An apparatus for measuring wafer bonding strength, the apparatus comprising:
- a wafer fixer configured to fix bonded wafers in position;
- and
- a measuring unit configured to measure the wafer bonding strength of the bonded wafers,
- wherein the measuring unit comprises:
- a blade configured to apply a force to a bonding interface between the bonded wafers from a contact side of the bonded wafers to part the bonded wafers;
- a driver configured to provide the blade with a driving force;
- and
- a sensor configured to measure the forces applied to the blade.
A method of measuring wafer bonding strength, the method comprising:
- applying forces to a blade making contact with a bonding interface between bonded wafers;
- and
- measuring the forces applied to the blade to determine the wafer bonding strength.
A method of driving a measurement apparatus of wafer bonding strength, the method comprising:
- fixing bonded wafers to a wafer stage;
- and
- driving a driver, which provides a blade with a driving force, to apply forces to the blade making contact with a bonding interface between the bonded wafers;
- and
- measuring the forces applied to the blade to determine the wafer bonding strength.
Dependencies are inferred from the claim text.