Gas filling docking tray and gas filling device

A gas filling docking tray, comprising:

• a carrier substrate having a base surface;
• at least three guide blocks disposed on a peripheral area of the base surface and spaced apart from each other to define a wafer carrier accommodation area, each guide block comprising a vertical portion substantially perpendicular to the base surface and an inclined portion located above and connected with the vertical portion;
• a plurality of positioning pins disposed in the wafer carrier accommodation area of the carrier substrate to position a wafer carrier, wherein a height of an apex of each of the positioning pins relative to the base surface is greater than a height of an apex of the vertical portion relative to the base surface and less than a height of an apex of the inclined portion relative to the base surface;
• at least one pair of fixed nozzles disposed in the wafer carrier accommodation area, wherein a height of an apex of each of the fixed nozzles relative to the base surface is less than the height of the apex of the vertical portion relative to the base surface;
• and
• at least one pair of retractable nozzles disposed in the wafer carrier accommodation area, wherein a height of an apex of each of the retractable nozzles relative to the base surface is less than the height of the apex of each of the positioning pins relative to the base surface and greater than the height of the apex of each of the fixed nozzles relative to the base surface.

A gas filling device comprising:

• a carrier substrate having a base surface;
• a plurality of guide blocks at least disposed on two opposite sides of the base surface to define a wafer carrier accommodation area, each guide block comprising a vertical portion substantially perpendicular to the base surface and an inclined portion located above and connected with the vertical portion;
• a plurality of positioning pins disposed in the wafer carrier accommodation area of the carrier substrate to position a wafer carrier, wherein a height of an apex of each positioning pin relative to the base surface is greater than a height of an apex of the vertical portion relative to the base surface and less than a height of an apex of the inclined portion relative to the base surface;
• at least one inlet port and at least one outlet port disposed in the wafer carrier accommodation area;
• an inflation module in fluid communication with the at least one inlet port;
• an exhaust module in fluid communication with the at least one outlet port;
• and
• a control module electrically connected to the inflation module and the exhaust module to control operations of the inflation module and the exhaust module.