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US 2024/0191362 A1Published application
Chemical solution for removing precious metal, method for manufacturing chemical solution, method for treating substrate, method for manufacturing semiconductor device
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsKazuhiro TAKAHASHI, Fusayo SAEKI
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Abstract
A chemical solution for removing a precious metal includes a cerium-containing oxidizing agent (A), a metal component (B) including a transition metal other than cerium, and water, in which a content of the metal component (B) is less than 1.65×10−3 parts by mass with respect to 1 part by mass of the cerium-containing oxidizing agent (A) in terms of the transition metal.
Claims6
A chemical solution for removing a precious metal, the chemical solution comprising:
- a cerium-containing oxidizing agent (A);
- a metal component (B) including a transition metal other than cerium;
- and
- water,
- wherein a content of the metal component (B) is less than 1.65×10−3 parts by mass with respect to 1 part by mass of the cerium-containing oxidizing agent (A) in terms of the transition metal.
2 more elements
Dependencies are inferred from the claim text.