Mask-frame assembly and producing method thereof
AssigneeOlum Material Corporation
InventorTaek Yong JANG
Life of this patent
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Abstract
The present invention relates to a mask-frame assembly and a producing method thereof. The mask-frame assembly according to the present invention is used in a process of forming organic light-emitting diode (OLED) pixels on a semiconductor wafer, and includes: a support including an edge portion and a grid portion; a mask connected onto the support and including a mask pattern; and an adhering support connected to a lower part of the support and including an auxiliary edge portion and an auxiliary grid portion, wherein the adhering support includes a magnetic material.
Claims20
A mask-frame assembly for use in a process of forming organic light-emitting diode (OLED) pixels on a semiconductor wafer, comprising:
- a support comprising an edge portion and a grid portion;
- a mask connected onto the support and including a mask pattern;
- and
- an adhering support connected to a lower part of the support and comprising an auxiliary edge portion and an auxiliary grid portion,
- wherein the adhering support includes a magnetic material.
A producing method of a mask-frame assembly for use in a process of forming organic light-emitting diode (OLED) pixels on a semiconductor wafer, comprising the steps of:
- (a) preparing a laminate of a support including an edge portion and a grid portion and a mask formed on the support by electroforming and including a mask pattern;
- (b) preparing an adhering support including an auxiliary edge portion and an auxiliary grid portion;
- and
- (c) connecting the adhering support onto a surface opposite to a surface of the support connected to the mask,
- wherein the adhering support includes a magnetic material.
Dependencies are inferred from the claim text.