Electrode plate supporting device, laser cutting apparatus and laser cutting method for electrode plate

Abstract

An electrode plate supporting device may be used in coordination with the laser assembly and may include a body constructed with an abutting surface for abutting against an electrode plate to tension the electrode plate. The laser assembly may be configured to emit laser to the abutting surface. During laser cutting, the electrode plate may abut against the abutting surface and closely fits the abutting surface to extend fully and thus may be in a flattened state, and therefore, the problem of defocusing caused by a wavy edge may be solved. Moreover, supported by the abutting surface, the electrode plate may be tensioned and not prone to shaking, and therefore, problems such as failing to cut off the incoming material due to easy shaking of the electrode plate may be effectively solved.

Dependencies are inferred from the claim text.