Heat exchange enhanced module shell

Abstract

Aspects of heat exchange enhanced module shells for pluggable transceiver modules are described. In one example, a pluggable transceiver module includes a module shell. The module shell includes an upper shell and a lower shell. The upper shell includes a planar inner surface and a recessed area formed into the planar inner surface. The module also includes a printed circuit board, a chip mounted on the printed circuit board, and a heat spreader secured within the recessed area, between the upper shell and the chip. The heat spreader can be a heat pipe, a vapor chamber, or a related heat spreading structure. The heat spreader helps to transfer the heat from the chip across a larger area of the upper shell of the module. The heat can be more effectively transferred to a heat sink of a mating connector or cage for the pluggable transceiver module.

Dependencies are inferred from the claim text.