Cooling device for cooling a semiconductor module and converter with the cooling device

A converter, comprising:

• a converter housing;
• and
• a cooling apparatus integrated in the converter housing, said cooling apparatus comprising a semiconductor module comprising a first cover face, a second cover face, with the first cover face facing away from the second cover face, a module face formed between the first and second cover faces, and a plurality of side faces designed to enclose the module space, a heat sink designed to cool the semiconductor module and comprising a base body, cooling elements formed on a first face of the base body and designed to project from the base body, and a cooling medium capable of flowing around the cooling elements and the plurality of side faces of the semiconductor module in a flow direction along the base body, with at least a first one of the plurality of side faces and a second one of the plurality of side faces of the semiconductor module forming a common side edge which faces the flow direction, wherein the semiconductor module is connected to the first face of the base body at the first cover face and designed for embedment between at least some of the cooling elements and designed for embedment between at least some of the cooling elements.