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US 2024/0188253 A1Published application
Cooling device for semiconductor device
AssigneeKioxia Corporation
InventorsTomoya SANUKI, Yasuhito YOSHIMIZU, Yusuke HIGASHI, Hideko MUKAIDA
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Abstract
A semiconductor device according to an embodiment includes: a chamber including an internal structure capable of holding a pressure in the chamber lower than atmospheric pressure; one or a plurality of cooling member provided inside of the internal structure of the chamber, the cooling member holding and cooling a semiconductor device; and a heat transfer part exchanging heat with a refrigerator cooling the cooling member.
Claims19
A cooling device for semiconductor device comprising:
- a chamber including an internal structure capable of holding a pressure in the chamber lower than atmospheric pressure;
- one or a plurality of cooling member provided inside of the internal structure of the chamber, the cooling member holding and cooling a semiconductor device;
- and
- a heat transfer part exchanging heat with a refrigerator cooling the cooling member.
1 more element
Dependencies are inferred from the claim text.