Pcb design to improve hfm connector performance

A method comprising:

• providing a multilayer assembly comprising a set of outer conductive layers and a plurality of intermediate layers;
• forming a ground guard of the multilayer assembly, the ground guard comprising a set of ground pads, a plurality of ground layers of the plurality of intermediate layers, and a set of vias,
• wherein:
• the set of vias are located on the set of ground pads and connect the plurality of ground layers;
• the set of vias are located between a ground pin and at least one signal pin of a plurality of signal pins in a direction parallel to a plane of the multilayer assembly;
• the ground pin and the plurality of signal pins are included in a footprint fabricated on an outer conductive layer of the set of outer conductive layers;
• and
• forming the set of vias is based on satisfying a signal integrity threshold associated with the at least one signal pin;
• and
• forming a solder mask on the outer conductive layer, wherein:
• a first opening of the solder mask corresponds to a boundary of a ground via included in the set of vias;
• at least a portion of a second opening of the solder mask is located between two signal pins of the plurality of signal pins;
• and
• the solder mask overlaps at least a portion of a path corresponding to the set of ground pads.

An apparatus comprising:

• a printed circuit board, wherein the printed circuit board comprises:
• a plurality of layers;
• a footprint fabricated on an outer layer of the plurality of layers;
• a plurality of signal pins and a ground pin, wherein the plurality of signal pins and the ground pin are included in the footprint;
• and
• a ground guard comprising:
• a set of ground pads;
• a plurality of ground layers of the plurality of layers;
• and
• a set of vias,
• wherein:
• the set of vias are located on the set of ground pads and connect the plurality of ground layers;
• the set of vias are located between the ground pin and at least one signal pin of the plurality of signal pins in a direction parallel to a plane of the plurality of layers;
• and
• a quantity of the set of vias is based on satisfying a signal integrity threshold associated with the at least one signal pin of the plurality of signal pins.

The apparatus of claim Error! Reference source not found., further comprising a solder mask disposed on the outer layer of the plurality of layers, wherein:

• a first opening of the solder mask corresponds to a boundary of a ground via included in the set of vias;
• at least a portion of a second opening of the solder mask is located between two signal pins of the plurality of signal pins;
• and
• the solder mask overlaps at least a portion of a path corresponding to the set of ground pads.