Light emitting diode package
AssigneeSeoul Viosys Co., Ltd.
InventorsSeung Gu MIN, Young Jin LEE
Life of this patent
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Abstract
A light emitting diode package is provided to include: a package substrate including a first substrate electrode and a second substrate electrode spaced apart from each other; a light emitting diode chip disposed on the package substrate to be electrically connected to the first substrate electrode and the second substrate electrode; and an encapsulant containing a fluorine compound and covering the light emitting diode chip to be at least partially in contact with the light emitting diode chip.
Claims20
A light emitting diode package, comprising:
- a package substrate including a first substrate electrode and a second substrate electrode that are spaced apart from each other;
- a light emitting diode chip disposed on the package substrate to be electrically connected to the first substrate electrode and the second substrate electrode;
- and
- an encapsulant containing a fluorine compound and covering the light emitting diode chip to be at least partially in contact with the light emitting diode chip.
A light emitting diode package, comprising:
- a package substrate;
- a light emitting diode chip disposed on the package substrate to be electrically connected to the package substrate;
- and
- an encapsulant containing a fluorine compound and covering the light emitting diode chip to be at least partially in contact with the light emitting diode chip,
- wherein the encapsulant is provided to transmit 80% or more of light emitted from the light emitting diode chip.
A light emitting diode package, comprising:
- a package substrate;
- a light emitting diode chip disposed on the package substrate to be electrically connected to the package substrate;
- and
- an encapsulant containing a fluorine compound and covering the light emitting diode chip to be at least partially in contact with the light emitting diode chip,
- wherein the encapsulant has a heat curing temperature of 200° C. to 300° C. inclusive.
Dependencies are inferred from the claim text.