Semiconductor packaging for image sensors

A method for forming a semiconductor package comprising:

• providing a package substrate with top and bottom major package substrate surfaces, wherein
• the top package substrate surface includes a die region with a die pad and a non-die region, the non-die region includes package bond pads and a cover adhesive region surrounding the die region, and
• the bottom package substrate surface includes package contact pads, wherein the package contact pads on the bottom package substrate surface are electrically connected to respective package bond pads on the top package substrate surface;
• providing a sensor die having active and non-active major die surfaces, wherein
• the active die surface includes a sensor region with a sensor, a non-sensor region with die bond pads and a cover adhesive region surrounding the sensor region, and
• attaching the inactive die surface of the die to the die pad;
• performing wire bonding to electrically connect the die bond pads on the active die surface and package bond pads on the top package substrate surface;
• attaching a transparent cover over the die covering the sensor region by a cover adhesive on the cover adhesive region of the top package substrate surface, wherein the cover forms a sealed cavity between the cover and sensor;
• encapsulating the package with a package encapsulation, the package encapsulation encapsulates the package substrate, wire bonds and side cover surfaces and outer sides of the cover adhesive;
• and
• forming an opaque layer on a top surface of the package encapsulation, wherein the opaque layer obscures the wire bonds within the encapsulation to reduce reflectance to improve sensor performance.

A semiconductor package comprising:

• a package substrate with top and bottom major package substrate surfaces, wherein
• the top package substrate surface includes a die region with a die pad and a non-die region, the non-die region includes package bond pads and a cover adhesive region surrounding the die region, and
• the bottom package substrate surface includes package contact pads, wherein the package contact pads on the bottom package substrate surface are electrically connected to respective package bond pads on the top package substrate surface;
• a sensor die having active and non-active major die surfaces, wherein
• the active die surface includes a sensor region with a sensor, a non-sensor region with die bond pads and a cover adhesive region surrounding the sensor region, and
• the inactive die surface is attached to the die pad:
• wire bonds connecting the die bond pads on the active die surface and package bond pads on the top package substrate surface;
• a transparent cover disposed over the die covering the sensor region, wherein the cover is attached by a cover adhesive on the cover adhesive region of the top package substrate surface, wherein the cover forms a sealed cavity between the cover and sensor;
• a package encapsulation, the package encapsulation encapsulates the package substrate, wire bonds and side cover surfaces and outer sides of the cover adhesive;
• and
• an opaque layer disposed on a top surface of the package encapsulation, wherein the opaque layer obscures the wire bonds within the encapsulation to reduce reflectance to improve sensor performance.