Gate-all-around devices with different gate oxide thicknesses
AssigneeIntel Corporation
InventorsHwichan Jun, Guillaume Bouche
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AssigneeIntel Corporation
InventorsHwichan Jun, Guillaume Bouche
Estimating the term…
Techniques are provided herein to form semiconductor devices having different gate oxide thicknesses. A first semiconductor device includes a first gate structure around a first plurality of semiconductor nanoribbons and a second semiconductor device includes a second gate structure around a second plurality of semiconductor nanoribbons. The first gate structure includes at least a first gate oxide layer and a first gate electrode, and the second gate structure includes at least a second gate oxide layer and a second gate electrode. The first gate oxide layer is thicker than the second gate oxide layer. A high-k dielectric layer may be formed over the first and second gate oxide layers or may be formed over the second gate oxide layer, but not over the first gate oxide layer.
An integrated circuit comprising:
An electronic device, comprising:
An integrated circuit comprising:
Dependencies are inferred from the claim text.