Semiconductor device
AssigneeKioxia Corporation
InventorsAkio WATANABE, Yusuke AKADA, Hideko MUKAIDA
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AssigneeKioxia Corporation
InventorsAkio WATANABE, Yusuke AKADA, Hideko MUKAIDA
Estimating the term…
A semiconductor device according to the present embodiment includes a substrate having a first surface, a first spacer and a second spacer, a first semiconductor chip, and a stacked body. The first semiconductor chip is provided on the first surface so as to be disposed between the first spacer and the second spacer. The stacked body is a stacked body that is provided above the first spacer, the second spacer, and the first semiconductor chip and in which a plurality of second semiconductor chips are stacked in a first direction. One of the second semiconductor chips, which is provided on the lowermost second semiconductor chip, is stacked with an offset relative to the lowermost second semiconductor chip in a second direction. A central position of the first semiconductor chip is separated from a central position of the lowermost second semiconductor chip in the second direction.
A semiconductor device comprising:
Dependencies are inferred from the claim text.