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US 2024/0182769 A1Published application
Heat sink paste, heat sink film and manufacturing methods therefor
AssigneeFoundation for Research and Business, Seoul National University of Science and Technology
InventorsHyung Jun KOO, Ji Hye KIM, Akyildiz KUBRA
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Abstract
The present disclosure relates to a heat sink paste, a heat sink film and manufacturing methods therefor. The heat sink paste according to an embodiment of the present disclosure includes an elastic polymer resin and conductive particles dispersed in the elastic polymer resin, wherein the conductive particles include solid metal particles and liquid metal particles.
Claims10
A heat sink paste (heat dissipation paste) comprising:
- an elastic polymer resin;
- and
- conductive particles dispersed in the elastic polymer resin,
- wherein the conductive particles comprise solid metal particles and liquid metal particles.
1 more element
A heat sink film (heat dissipation film) comprising:
- an elastic polymer;
- and
- conductive particles embedded in the elastic polymer,
- wherein the conductive particles comprise solid metal particles and liquid metal particles, and the solid metal particles and the liquid metal particles are arranged in a heat transfer direction by applying an electric field.
1 more element
Dependencies are inferred from the claim text.