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US 2024/0182677 A1Published application
Curable Compositions
OwnerTomoaki Nakanishi, Yoji Nakajima +2inventors
InventorsTomoaki Nakanishi, Yoji Nakajima, Laibao Zhang, Gregory Roy Almen
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Abstract
This disclosure relates to a curable composition that includes at least one polymer and hollow silica particles. This disclosure also relates to using the composition to form a free-standing film, a laminate, a prepreg, and/or a printed circuit board.
Claims46
A curable composition, comprising:
- at least one thermosetting resin comprising a poly(phenylene ether), a maleimide-containing compound, a polyindane, or a copolymer comprising a styrene monomer unit, a methylstyrene monomer unit, a butylstyrene monomer unit, a divinylbenzene monomer unit, a 4-(dimethylvinylsilylmethyl)styrene monomer unit, or a pyrimidine, pyrazine, pyridazine, or pyridine monomer unit, the thermosetting resin comprising at least two carbon-carbon double bonds;
- and
- at least one filler comprising hollow silica particles.
A curable composition, comprising:
- at least one polymer comprising a methylstyrene monomer unit;
- and
- at least one filler comprising hollow silica particles.
Dependencies are inferred from the claim text.