Thermally conductive fillers

Abstract

The present invention relates to a thermally conductive filler composition comprising a mixture of fillers comprising at least one inorganic aluminium compound and at least one inorganic magnesium compound, wherein the fillers are in form of particles having a volume median particle size d50 from 0.1 to 500 μm, and the mixture of fillers comprises a first filler fraction A and a second filler fraction B. Furthermore, the present invention relates to a polymeric composition comprising the same as well as to the use of said thermally conductive filler composition.

Dependencies are inferred from the claim text.