Copper paste for forming sintered copper pillars and method for producing bonded body

Abstract

Copper paste for forming a sintered copper pillar containing copper particles and an organic dispersion medium, in which the copper paste contains first sub-micro copper particles having a volume-average particle size of 0.05 to 0.35 μm, second sub-micro copper particles having a volume-average particle size of 0.5 to 1.5 μm, and spherical micro copper particles having a volume-average particle size of 2 to 5 μm as the copper particles, a content of the first sub-micro copper particles is 40 to 70% by mass on the basis of the total mass of the copper particles, a content of the second sub-micro copper particles is 10 to 40% by mass on the basis of the total mass of the copper particles, and a content of the spherical micro copper particles is 15 to 45% by mass on the basis of the total mass of the copper particles.

Dependencies are inferred from the claim text.