Cutting method for polymer resin mold compound based substrates and system thereof

A method of singulation of a polymer resin mold compound-based substrate into packages by a laser cutting process comprised of steps of,

• pre-heating the polymer resin mold compound-based substrate at a buffer station comprising a heated plate,
• loading the polymer resin mold compound-based substrate onto a cutting jig,
• activating a vacuum from at least one vacuum chamber to secure the polymer resin mold compound-based substrate to the cutting jig,
• activating a pulse laser to cut the polymer resin mold compound-based substrate along a series of trenches that are embedded in the cutting jig,
• ejecting pressurized air or gas through cutting nozzle in the direction of the laser to allow single pass singulation of units at high speed;
• and
• circulating a liquid through a base plate of the cutting jig to cool the polymer resin mold compound-based substrate,
• an additional step of injecting fast-cooling gas to cool the polymer resin mold compound-based substrate to preserve its form after pre-heating before loading the polymer resin mold compound-based substrate onto the cutting jig.