Laser diode and laser diode manufacturing method
AssigneeIngentec Corporation
InventorsAi-Sen LIU, Hsiang-An FENG, Cheng-Yu CHUNG, Ya-Li CHEN
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AssigneeIngentec Corporation
InventorsAi-Sen LIU, Hsiang-An FENG, Cheng-Yu CHUNG, Ya-Li CHEN
Estimating the term…
A laser diode includes an original substrate having a substrate coefficient of thermal expansion, an epitaxy structure formed on the original substrate, and a composite multi-layer metal board disposed below the original substrate and at least including a first metal layer and a second metal layer. The first metal layer and the second metal layer are stacked, a material of the first metal layer is different from a material of the second metal layer, and the composite multi-layer metal board has a modified coefficient of thermal expansion. The original substrate has an initial thickness as the epitaxy structure is grown thereon, the original substrate is thinned to a combining thickness for attaching the composite multi-layer metal board, and the modified coefficient of thermal expansion of the composite multi-layer metal board is proximate to the substrate coefficient of thermal expansion.
A laser diode, comprising:
A laser diode manufacturing method, comprising:
Dependencies are inferred from the claim text.