Miniaturized high-speed interposer

A method for manufacturing an interposer comprising:

• inserting a plurality of electrical contacts into respective first openings extending between a top surface and a bottom surface opposite the top surface of a housing, wherein the first openings are arranged in a plurality of lines;
• stamping from a sheet of metal a shield including a plurality of shield contacts extending from a first edge of the shield;
• and
• inserting the shield into a channel of the housing such that the plurality of shield contacts extend through the top surface, wherein the channel is disposed between two adjacent lines of the first openings.

An interposer, comprising:

• an insulative housing comprising:
• a top surface and a bottom surface opposite the top surface;
• a plurality of electrical contacts disposed in at least two parallel lines at least in part within the insulative housing, wherein each electrical contact includes a first contact portion extending above the top surface of the insulative housing;
• and
• a shield comprising:
• a body disposed at least in part within the insulative housing between two adjacent parallel lines of the at least two parallel lines;
• and
• a plurality of first shield contacts connected to the body,
• wherein:
• the plurality of first shield contacts extend through the top surface of the insulative housing;
• and
• the plurality of first shield contacts are configured such that when the top surface of the interposer is compressed against a substrate, shield contacts of the plurality of first shield contacts contact the body of the shield.