Semiconductor device manufacturing method

A photoelectric conversion system comprising:

• a semiconductor device formed by using a manufacturing method including:
• preparing a first substrate having a first plane and a second plane facing the first plane;
• preparing a second substrate having a third plane and a fourth plane facing the third plane;
• forming a first semiconductor device and a first wiring layer on a side of the first substrate where the first plane is provided;
• forming an insulating region from a side of the second substrate where the third plane is provided;
• after the forming the insulating region, forming a second semiconductor device and a second wiring layer on the side where the third plane is provided;
• after the forming the second semiconductor device and the second wiring layer, thinning the second substrate from a side where the fourth plane is provided to expose the insulating region;
• after exposing the insulating region, forming a through-electrode configured to penetrate through the insulating region and be connected to the second wiring layer;
• and
• joining the first substrate and the second substrate so as to be electrically connected to each other;
• and
• a signal processing unit configured to generate an image using a signal output by the semiconductor device.

A moving object including a semiconductor device formed by using a manufacturing method including:

• preparing a first substrate having a first plane and a second plane facing the first plane;
• preparing a second substrate having a third plane and a fourth plane facing the third plane;
• forming a first semiconductor device and a first wiring layer on a side of the first substrate where the first plane is provided;
• forming an insulating region from a side of the second substrate where the third plane is provided;
• after the forming the insulating region, forming a second semiconductor device and a second wiring layer on the side where the third plane is provided;
• after the forming the second semiconductor device and the second wiring layer, thinning the second substrate from a side where the fourth plane is provided to expose the insulating region;
• after exposing the insulating region, forming a through-electrode configured to penetrate through the insulating region and be connected to the second wiring layer;
• and
• joining the first substrate and the second substrate so as to be electrically connected to each other;
• the moving object comprising:
• a controller configured to control movement of the moving object using a signal output by the semiconductor device.