Hermetic package device and device module

A hermetic package device comprising:

• a device wafer in which a semiconductor circuit and terminals for electrical connection to an outside are provided on a mounting surface;
• a lid wafer arranged to be opposed to the mounting surface of the device wafer;
• and
• a sealing part that surrounds an installation region of the semiconductor circuit in the mounting surface, is interposed between the device wafer and the lid wafer, and forms a hermetically sealed space in a vacuum atmosphere to house the semiconductor circuit between the device wafer and the lid wafer, wherein
• a second installation region in the mounting surface in which the terminals are provided protrudes relative to the lid wafer, and
• an outer surface of a portion in the sealing part facing the second installation region is inclined such that a position thereon approaches the second installation region when getting closer from the device wafer toward the lid wafer.