Display device and manufacturing method of display device

A display device comprising:

• a first semiconductor portion made of a first semiconductor film;
• a first insulating film disposed on an upper-layer side of the first semiconductor film;
• a first electrode made of a first conductive film disposed on an upper-layer side of the first insulating film and disposed to overlap a part of the first semiconductor portion;
• a second insulating film disposed on an upper-layer side of the first conductive film;
• a second semiconductor portion made of a second semiconductor film disposed on an upper-layer side of the second insulating film;
• a third insulating film disposed on an upper-layer side of the second semiconductor film;
• a second electrode made of a second conductive film disposed on an upper-layer side of the third insulating film and disposed to overlap a part of the second semiconductor portion;
• a fourth insulating film disposed on an upper-layer side of the second conductive film;
• a third electrode made of a third conductive film disposed on an upper-layer side of the fourth insulating film and disposed at a position overlapping the first semiconductor portion and not overlapping the first electrode;
• and
• a fourth electrode made of a part of the third conductive film different from the third electrode and disposed at a position overlapping the second semiconductor portion and not overlapping the second electrode,
• wherein the second insulating film is disposed to overlap at least the second semiconductor portion and is not formed in a range overlapping the first semiconductor portion,
• the third insulating film is disposed to overlap at least the second electrode,
• a first contact hole connecting the third electrode to the first semiconductor portion is provided in the first insulating film and the third insulating film at a position overlapping the first semiconductor portion and the fourth electrode, and
• a second contact hole connecting the fourth electrode to the second semiconductor portion is provided in the fourth insulating film at a position overlapping the second semiconductor portion and the fourth electrode.

A manufacturing method of a display device, the manufacturing method comprising:

• performing film formation of a first semiconductor film and patterning the first semiconductor film to provide a first semiconductor portion;
• performing film formation of a first insulating film on an upper-layer side of the first semiconductor film:
• performing film formation of a first conductive film on an upper-layer side of the first insulating film and patterning the first conductive film to provide a first electrode and a second electrode disposed to overlap a part of the first semiconductor portion;
• performing film formation of a second insulating film on an upper-layer side of the first conductive film;
• performing film formation of a second semiconductor film on an upper-layer side of the second insulating film and patterning the second semiconductor film to provide a second semiconductor portion including a part disposed to overlap the second electrode;
• patterning the second insulating film to overlap at least the second semiconductor portion and not being formed in a range overlapping the first semiconductor portion;
• performing film formation of a third insulating film on an upper-layer side than the second semiconductor film and patterning the third insulating film to provide a part of a first contact hole at a position overlapping a part of the first semiconductor portion and not overlapping the first electrode and to provide a second contact hole at a position overlapping a part of the second semiconductor portion;
• patterning the first insulating film subsequent to the third insulating film to provide a part of the first contact hole at a position overlapping a part of the first semiconductor portion and not overlapping the first electrode;
• and
• performing film formation of a second conductive film on an upper-layer side of the third insulating film and patterning the second conductive film to provide a third electrode disposed to overlap the first contact hole and connected to the first semiconductor portion through the first contact hole and a fourth electrode disposed to overlap the second contact hole and connected to the second semiconductor portion through the second contact hole.