Semiconductor device and corresponding method

A method, comprising:

• providing, at first and second opposed surfaces of a semiconductor die, first and second electrically conductive patterns extending at the first and second opposed surfaces of the semiconductor die, respectively, to provide electrical coupling to the at least one semiconductor die;
• and
• arranging an electrical component with a length transverse to the first and second opposed surfaces of the semiconductor die;
• wherein the electrical component extends between the first and second opposed surfaces of the semiconductor die and has opposed electrical contact end terminals coupled to the first and second electrically conductive patterns at the first and second opposed surfaces of the semiconductor die;
• wherein the at electrical component is electrically coupled to the semiconductor die via the first and second electrically conductive patterns at the first and second opposed surfaces of the semiconductor die.

A method, comprising:

• mounting a semiconductor die to a first carrier with a first surface of the semiconductor die facing a surface of the first carrier;
• mounting an electrical component having first and second terminals to the first carrier with the first terminal of the electrical component facing the surface of the first carrier, the electrical component having a length which extends transverse to the surface of the first carrier;
• encapsulating the semiconductor die and the electrical component in a first encapsulant having a first surface that is coplanar to a second surface of the semiconductor die that is opposed to the first surface and coplanar to the second terminal of the electrical component;
• forming a first electrically conductive pattern on the coplanar second surface of the semiconductor die, first surface of the first encapsulant and second terminal of the electrical component, said first electrically conductive pattern making an electrical connection to at least the second terminal of the electrical component;
• encapsulating the first electrically conductive pattern in a second encapsulant;
• removing the first carrier to expose the first terminal of the electrical component and a second surface of the first encapsulant which is opposite to the first surface of the first encapsulant;
• mounting a second carrier to a surface of the second encapsulant;
• forming a second electrically conductive pattern on the second surface of the first encapsulant and first terminal of the electrical component, said second electrically conductive pattern making an electrical connection to at least the first terminal of the electrical component;
• and
• encapsulating the second electrically conductive pattern in a third encapsulant.